First, cover the gold fingers and anything else that must stay free of solder.
A silicone-adhesive tape for masking PCB gold fingers through solder pots, tin spray and wave soldering. Rated to 220 °C; after 200 °C for 1 hour, it peels off with no residue.
For PCB assemblers, plating shops, die-cutters and distributors · no residue after 200 °C for 1 hour · reply within 24 hours.
Also for masking before painting: up to 30 minutes at 200 °C, green tape is enough; for an hour, or up to 220 °C, you need polyimide tape.
First, cover the gold fingers and anything else that must stay free of solder.
The board goes through the solder pot, tin spray or wave soldering with the tape on.
After soldering, peel the tape off — no adhesive left on the gold fingers.
No residue after 200 °C for 1 hour is on the data sheet, and we tested it ourselves too; 260 °C for 1 minute is an extra test we ran.
We put the tape on steel, baked it at 260 °C for 1 minute, let it sit for 2 hours, then peeled it: no adhesive left on the steel. After 1 hour at 200 °C, the same result. Our own tests, September 2026.
The tape has two layers: 0.025 mm amber polyimide film underneath, and a 0.025 mm coat of silicone adhesive on top (SH-JX001 data sheet). Full rolls are 500 mm wide; the ones in front are slit rolls.
| Grade | Thickness (mm) | Tack (N/25mm) | Heat rating | Roll width (mm) |
|---|---|---|---|---|
| SH-JX001 | 0.05±0.01 | 7±2 | 220 °C | 500 |
| SH-JX002 | 0.080±0.01 | 7±2 | 220 °C | 500 |
| SH-JX003 | 0.10±0.01 | 7±2 | 220 °C | 500 |
| SH-JX004 | 0.135±0.01 | 7±2 | 220 °C | 500 |
These are the values on our spec sheet; tack is measured on SUS304 mirror steel. The SH-JX001 data sheet gives the method: 180° peel at 300 mm per minute, 23±2 °C, 55±20% RH. Rolls are slit to the width you need.
You do not need to read every page. Choose the question that matches your process, and we will show you the evidence to check before you request a sample.
See the PCB sequence: cover the gold fingers, take the board through the heat, then peel the tape away.
See the PCB process →02 · Material choiceCompare its 200 °C, 30-minute masking window with PI tape rated to 220 °C.
Compare the other tape →03 · Data checkFirst make sure the substrate, peel angle, speed, temperature and humidity are the same.
Read the test method →If you have a tape you use now, send us a piece — we'll test it first, then match it and aim to do better. I'll reply within 24 hours: leave me a message with the button below, or email me directly.
Email: daodao@siliconefilmtape.com
Samples are free; you cover the freight.
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